New product development

• IP creation
• Process development
• Device and mixed-mode simulations
• Custom design layout
• Wafer-level testing
• Packaged parts characterisation
• System-level evaluation
• Transfer from R&D to high volume production
• Qualification
• Product optimisation for high yield and reliability

Optimisation of existing products

• Application-targeted product tuning and optimisation
• Product evaluation in the application and robustness improvement
• Final solution improvement by integration of additional features into the existing product
• IP generation
• Improved reliability and thermal performance

Transfer from R&D to production

• Die optimisation for reduced size, high production yield and reliability
• IP generation
• HV reliability testing and qualification
• SOA improvement

Interface with foundries/IDMs

• Design, layout and process optimisation
• Creation of competitive HV technologies from scratch
• Development of HV products using existing process modules
• Design and/or process tuning for improved yield, performance and lower cost
• Application-specific product optimisation
• IP generation

Optimisation for cost reduction

• High voltage testing in the application
• Yield, reliability and SOA improvement
• IP generation for more competitive solution or new market penetration
• Cost reduction
• Qualification and reliability testing and improvement

Qualification

• Design of test circuitry for reliability evaluation
• HV testing and evaluation of chip reliability
• Process and design optimisation for improved reliability and better SOA
• Optimisation for yield improvement